Invention Grant
- Patent Title: High-frequency module
- Patent Title (中): 高频模块
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Application No.: US14029036Application Date: 2013-09-17
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Publication No.: US08692628B2Publication Date: 2014-04-08
- Inventor: Yoshiyuki Ishiyama
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2012-041029 20120228
- Main IPC: H01P1/36
- IPC: H01P1/36

Abstract:
In a high-frequency module, an input terminal, an output terminal and a ground terminal, which are arranged so as to be capable of being visually checked, and wiring line electrodes located on a mounting surface are electrically connected to each other by wires and therefore the connection state of a non-reciprocal circuit element to the wiring line electrodes on the mounting surface of the substrate can be easily visually checked and an impedance adjustment between the non-reciprocal circuit element and the wiring line electrodes located on the mounting surface of the substrate on which the non-reciprocal circuit element is mounted or electronic components mounted on the mounting surface can be easily performed by adjusting the lengths of the wires.
Public/Granted literature
- US20140015620A1 HIGH-FREQUENCY MODULE Public/Granted day:2014-01-16
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