Invention Grant
- Patent Title: Power boosting circuit for semiconductor packaging
- Patent Title (中): 半导体封装功率升压电路
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Application No.: US13287237Application Date: 2011-11-02
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Publication No.: US08692611B2Publication Date: 2014-04-08
- Inventor: Richard Dewitt Crisp , Michael C. Parris , Mark Kroot
- Applicant: Richard Dewitt Crisp , Michael C. Parris , Mark Kroot
- Applicant Address: US CA San Jose
- Assignee: Tessera, Inc.
- Current Assignee: Tessera, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Lerner, David, Littenberg, Krumholz & Mentlik, LLP
- Priority: KR10-2011-0081620 20110817
- Main IPC: G05F1/10
- IPC: G05F1/10
Abstract:
A microelectronic package includes a microelectronic element operable to output a discrete-value logic signal indicating an imminent increase in demand for current by at least some portion of the microelectronic element. An active power delivery element within the package is operable by the logic signal to increase current delivery to the microelectronic element.
Public/Granted literature
- US20130043935A1 POWER BOOSTING CIRCUIT FOR SEMICONDUCTOR PACKAGING Public/Granted day:2013-02-21
Information query
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