Invention Grant
- Patent Title: Integrated circuit system with sub-geometry removal and method of manufacture thereof
- Patent Title (中): 具有子几何去除的集成电路系统及其制造方法
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Application No.: US13657797Application Date: 2012-10-22
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Publication No.: US08692380B2Publication Date: 2014-04-08
- Inventor: Soon Yoeng Tan , Huey Ming Chong , Byoung-Il Choi , Soo Muay Goh
- Applicant: GlobalFoundries Singapore Pte. Ltd.
- Applicant Address: SG Singapore
- Assignee: GLOBALFOUNDRIES Singapore Pte. Ltd.
- Current Assignee: GLOBALFOUNDRIES Singapore Pte. Ltd.
- Current Assignee Address: SG Singapore
- Agency: Ishimaru & Associates LLP
- Main IPC: H01L23/58
- IPC: H01L23/58 ; H01L29/41

Abstract:
A method of manufacture of an integrated circuit system includes: forming reticle data; detecting a sub-geometry, a singularity, or a combination thereof in the reticle data; applying a unit cell, a patch cell, or a combination thereof for removing the sub-geometry, the singularity, or the combination thereof from the reticle data; and fabricating an integrated circuit from the reticle data.
Public/Granted literature
- US20130043565A1 INTEGRATED CIRCUIT SYSTEM WITH SUB-GEOMETRY REMOVAL AND METHOD OF MANUFACTURE THEREOF Public/Granted day:2013-02-21
Information query
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