Invention Grant
- Patent Title: Electric part package and manufacturing method thereof
- Patent Title (中): 电气部件包装及其制造方法
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Application No.: US13295202Application Date: 2011-11-14
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Publication No.: US08692363B2Publication Date: 2014-04-08
- Inventor: Naoyuki Koizumi , Masahiro Kyozuka , Kenta Uchiyama
- Applicant: Naoyuki Koizumi , Masahiro Kyozuka , Kenta Uchiyama
- Applicant Address: JP Nagano
- Assignee: Shinko Electric Industries Co., Ltd.
- Current Assignee: Shinko Electric Industries Co., Ltd.
- Current Assignee Address: JP Nagano
- Agency: IPUSA, PLLC
- Priority: JP2010-256076 20101116
- Main IPC: H01L23/02
- IPC: H01L23/02
Abstract:
A disclosed electric part package includes a supporting member that includes a first area in which an electric part is arranged, and a second area in which a first opening is positioned, the second area being isolated from the first area; a resin part provided on the supporting member thereby to cover the electric part arranged in the first area, the resin part including an electric terminal exposed in the first opening of the supporting member; and a wiring structure provided on the resin part, the wiring structure being electrically connected to the electric part and the electric terminal of the resin part.
Public/Granted literature
- US20120119379A1 ELECTRIC PART PACKAGE AND MANUFACTURING METHOD THEREOF Public/Granted day:2012-05-17
Information query
IPC分类:
