Invention Grant
- Patent Title: Decoupling capacitor and method of making same
- Patent Title (中): 去耦电容及其制作方法
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Application No.: US13344137Application Date: 2012-01-05
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Publication No.: US08692306B2Publication Date: 2014-04-08
- Inventor: Chung-Hui Chen
- Applicant: Chung-Hui Chen
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Duane Morris LLP
- Agent Steven E. Koffs
- Main IPC: H01L27/06
- IPC: H01L27/06 ; H01L21/02

Abstract:
A semiconductor substrate has at least two active regions, each having at least one active device that includes a gate electrode layer, and a shallow trench isolation (STI) region between the active regions. A decoupling capacitor comprises first and second dummy conductive patterns formed in the same gate electrode layer over the STI region. The first and second dummy conductive regions are unconnected to any of the at least one active device. The first dummy conductive pattern is connected to a source of a first potential. The second dummy conductive pattern is connected to a source of a second potential. A dielectric material is provided between the first and second dummy conductive patterns.
Public/Granted literature
- US20130175589A1 DECOUPLING CAPACITOR AND METHOD OF MAKING SAME Public/Granted day:2013-07-11
Information query
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