Invention Grant
- Patent Title: Memory devices containing a high-K dielectric layer
- Patent Title (中): 包含高K电介质层的存储器件
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Application No.: US10927692Application Date: 2004-08-27
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Publication No.: US08691647B1Publication Date: 2014-04-08
- Inventor: Wei Zheng , Arvind Halliyal , Mark T. Ramsbey , Jack F. Thomas
- Applicant: Wei Zheng , Arvind Halliyal , Mark T. Ramsbey , Jack F. Thomas
- Applicant Address: US CA Sunnyvale
- Assignee: Spansion LLC
- Current Assignee: Spansion LLC
- Current Assignee Address: US CA Sunnyvale
- Main IPC: H01L21/336
- IPC: H01L21/336

Abstract:
In one embodiment, a semiconductor device is disclosed. The semiconductor device is formed on a semiconductor substrate having an active region, the semiconductor device comprising: a gate dielectric layer disposed on the semiconductor substrate, the gate dielectric layer having at least two sub-layers with at least one sub-layer having a dielectric constant greater than SiO2; a floating gate formed on the gate dielectric layer defining a channel interposed between a source and a drain formed within the active region of the semiconductor substrate; a control gate formed above the floating gate; and an intergate dielectric layer interposed between the floating gate and the control gate, the intergate dielectric layer comprising: a first layer formed on the floating gate; a second layer formed on the first layer; and a third layer formed on the second layer, wherein each of the first, second and third layers has a dielectric constant greater than SiO2.
Information query
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