Invention Grant
- Patent Title: Semiconductor chip device with underfill
- Patent Title (中): 具有底部填充的半导体芯片器件
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Application No.: US12878812Application Date: 2010-09-09
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Publication No.: US08691626B2Publication Date: 2014-04-08
- Inventor: Michael Z. Su , Lei Fu , Gamal Refai-Ahmed , Bryan Black
- Applicant: Michael Z. Su , Lei Fu , Gamal Refai-Ahmed , Bryan Black
- Applicant Address: US CA Sunnyvale CA Markham
- Assignee: Advanced Micro Devices, Inc.,ATI Technologies ULC
- Current Assignee: Advanced Micro Devices, Inc.,ATI Technologies ULC
- Current Assignee Address: US CA Sunnyvale CA Markham
- Agent Timothy M. Honeycutt
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L23/48
Abstract:
A method of manufacturing is provided that includes placing a removable cover on a surface of a substrate. The substrate includes a first semiconductor chip positioned on the surface. The first semiconductor chip includes a first sidewall. The removable cover includes a second sidewall positioned opposite the first sidewall. A first underfill is placed between the first semiconductor chip and the surface wherein the second sidewall provides a barrier to flow of the first underfill. Various apparatus are also disclosed.
Public/Granted literature
- US20120061853A1 SEMICONDUCTOR CHIP DEVICE WITH UNDERFILL Public/Granted day:2012-03-15
Information query
IPC分类:
