Invention Grant
US08691341B2 Method of controlling the height of encapsulant on an inkjet printhead
有权
控制喷墨打印头上的密封剂的高度的方法
- Patent Title: Method of controlling the height of encapsulant on an inkjet printhead
- Patent Title (中): 控制喷墨打印头上的密封剂的高度的方法
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Application No.: US13249520Application Date: 2011-09-30
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Publication No.: US08691341B2Publication Date: 2014-04-08
- Inventor: Neal D. Erickson , Kirk L. Stechschulte , Steven R. Komplin , Ronald W. Bunn , Richard L. Warner , Girish S. Patil , Kyle B. Freels
- Applicant: Neal D. Erickson , Kirk L. Stechschulte , Steven R. Komplin , Ronald W. Bunn , Richard L. Warner , Girish S. Patil , Kyle B. Freels
- Applicant Address: US KY Lexington
- Assignee: Lexmark International, Inc.
- Current Assignee: Lexmark International, Inc.
- Current Assignee Address: US KY Lexington
- Main IPC: B05D3/12
- IPC: B05D3/12

Abstract:
A method of controlling a height of an encapsulant material on an inkjet printhead is provided. The method includes dispensing the encapsulant material on an outer portion of the inkjet printhead. The encapsulant material is then depressed to reduce its height on the outer portion of the inkjet printhead. The encapsulant material may be depressed directly after dispensing or before it completely cures. The encapsulant material may be completely cured before reducing its height. The height of the cured encapsulant material may be reduced by removing a top portion of the encapsulant material through machining operation. Reducing the height of the encapsulant material on the inkjet printhead minimizes the distance of the nozzle plate of the inkjet printhead to the printing media, thus improving print quality.
Public/Granted literature
- US20130084397A1 METHOD OF CONTROLLING THE HEIGHT OF ENCAPSULANT ON AN INKJET PRINTHEAD Public/Granted day:2013-04-04
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