Invention Grant
- Patent Title: Method and device for thermocompression bonding
- Patent Title (中): 用于热压接的方法和装置
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Application No.: US13270605Application Date: 2011-10-11
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Publication No.: US08691039B2Publication Date: 2014-04-08
- Inventor: Tsukasa Murota
- Applicant: Tsukasa Murota
- Applicant Address: JP Tokyo JP Tokyo
- Assignee: Sony Corporation,Sony DADC Corporation
- Current Assignee: Sony Corporation,Sony DADC Corporation
- Current Assignee Address: JP Tokyo JP Tokyo
- Agency: Wolf, Greenfield & Sacks, P.C.
- Priority: JPP2010-233935 20101018
- Main IPC: B29C65/02
- IPC: B29C65/02
Abstract:
There are provided a method and device for thermocompression bonding of possibly preventing any warping of a resin member to be caused by thermocompression bonding, and of possibly reducing the time to be taken for processing. The method for thermocompression bonding, includes: preheating a resin member using an infrared radiation section; and subjecting the resin member to thermocompression bonding using a heating section and a pressurization section.
Public/Granted literature
- US20120205040A1 METHOD AND DEVICE FOR THERMOCOMPRESSION BONDING Public/Granted day:2012-08-16
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