Invention Grant
US08691023B2 Methods and apparatus for cleaning deposition chamber parts using selective spray etch
有权
使用选择性喷涂蚀刻来清洁沉积室部件的方法和设备
- Patent Title: Methods and apparatus for cleaning deposition chamber parts using selective spray etch
- Patent Title (中): 使用选择性喷涂蚀刻来清洁沉积室部件的方法和设备
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Application No.: US13585294Application Date: 2012-08-14
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Publication No.: US08691023B2Publication Date: 2014-04-08
- Inventor: Liyuan Bao , Samantha S. H. Tan , Anbei Jiang
- Applicant: Liyuan Bao , Samantha S. H. Tan , Anbei Jiang
- Applicant Address: US PA Dublin
- Assignee: Quantum Global Technologies, LLP
- Current Assignee: Quantum Global Technologies, LLP
- Current Assignee Address: US PA Dublin
- Agency: Fox Rothschild LLP
- Main IPC: B08B3/00
- IPC: B08B3/00
Abstract:
In one aspect, a method of cleaning an electronic device manufacturing process chamber part is provided, including a) spraying the part with an acid; b) spraying the part with DI water; and c) treating the part with potassium hydroxide. Other aspects are provided.
Public/Granted literature
- US20130037062A1 METHODS AND APPARATUS FOR CLEANING DEPOSITION CHAMBER PARTS USING SELECTIVE SPRAY ETCH Public/Granted day:2013-02-14
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