Invention Grant
- Patent Title: Heat equalizer and organic film forming apparatus
- Patent Title (中): 热均衡器和有机成膜装置
-
Application No.: US12934190Application Date: 2008-04-11
-
Publication No.: US08691017B2Publication Date: 2014-04-08
- Inventor: Tadahiro Ohmi , Masafumi Kitano , Hisaaki Yamakage , Yoshihito Yamada
- Applicant: Tadahiro Ohmi , Masafumi Kitano , Hisaaki Yamakage , Yoshihito Yamada
- Applicant Address: JP Sendai-shi JP Tokyo
- Assignee: National University Corporation Tohoku University,Toshiba Mitsubishi—Electric Industrial Systems Corporation
- Current Assignee: National University Corporation Tohoku University,Toshiba Mitsubishi—Electric Industrial Systems Corporation
- Current Assignee Address: JP Sendai-shi JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- International Application: PCT/JP2008/057205 WO 20080411
- International Announcement: WO2009/125497 WO 20091015
- Main IPC: C23C16/00
- IPC: C23C16/00 ; F22B1/02 ; F02B75/00 ; F27D11/00 ; A01G13/06 ; A01M13/00 ; A01M19/00 ; A61B16/00 ; A61L9/03 ; B01B1/00 ; F02M15/04 ; F02M31/12 ; F22B1/20 ; B01D7/00 ; C23C14/00 ; A61H33/06 ; B01D1/00 ; B01D3/00 ; B05B1/24 ; F22B1/28 ; F24F6/00 ; A61H33/12 ; D06F75/00 ; F17C7/04

Abstract:
A heat equalizer includes a container structure having a heating block in which a working fluid is held for heating and vaporizing a material to be heated, a heater placed at the bottom of the container structure, and a material feed pipe allowing the outside and the inside of the container structure to communicate with each other. In the heating block, as a flow path in which the material to be heated flows, a main header pipe connected to the material feed pipe and extending in the horizontally, and a riser pipe branching from the main header pipe and extending vertically are formed. As a condensation path in which the working fluid is cooled and condensed, condensation holes formed respectively on the opposite sides of the riser pipe and extending horizontally, and a condensation pit formed under the riser pipe are formed. Between the condensation holes and the condensation pit, the main header pipe is placed.
Public/Granted literature
- US20110041768A1 HEAT EQUALIZER AND ORGANIC FILM FORMING APPARATUS Public/Granted day:2011-02-24
Information query
IPC分类: