Invention Grant
- Patent Title: Intervertebral implant for transforaminal posterior lumbar interbody fusion procedure
- Patent Title (中): 椎间植入物用于经椎间孔后路腰椎间融合术
-
Application No.: US13861842Application Date: 2013-04-12
-
Publication No.: US08690949B2Publication Date: 2014-04-08
- Inventor: Dominique Messerli , David Gerber , David Paul , Kenneth Isamu Kobayashi
- Applicant: DePuy Synthes Products, LLC
- Applicant Address: US MA Raynham
- Assignee: DePuy Synthes Products, LLC
- Current Assignee: DePuy Synthes Products, LLC
- Current Assignee Address: US MA Raynham
- Agency: Stradley Ronon Stevens & Young, LLP
- Main IPC: A61F2/44
- IPC: A61F2/44

Abstract:
An intervertebral implant for fusing vertebrae is disclosed. The implant may have a body with curved, posterior and anterior faces separated by two narrow implant ends, superior and inferior faces having a plurality of undulating surfaces for contacting vertebral endplates, and at least one depression in the anterior or posterior face for engagement by an insertion tool. The implant may also have one or more vertical through-channels extending through the implant from the superior face to the inferior face, a chamfer on the superior and inferior surfaces at one of the narrow implant ends, and/or a beveled edge along a perimeter of the superior and inferior faces. The implant configuration facilitates transforaminal insertion of the implant into a symmetric position about the midline of the spine so that a single implant provides balanced support to the spinal column. The implant may be formed of a plurality of interconnecting bodies assembled to form a single unit. An implantation kit and method are also disclosed.
Public/Granted literature
- US20130226303A1 INTERVERTEBRAL IMPLANT FOR TRANSFORAMINAL POSTERIOR LUMBAR INTERBODY FUSION PROCEDURE Public/Granted day:2013-08-29
Information query
IPC分类: