Invention Grant
- Patent Title: Intervertebral implant
- Patent Title (中): 椎间植入物
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Application No.: US13733336Application Date: 2013-01-03
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Publication No.: US08690946B2Publication Date: 2014-04-08
- Inventor: Daniel Baumgartner , Martin Wymann , Mario Gago Ho , Adrian Burri
- Applicant: DePuy Synthes Products, LLC
- Applicant Address: US MA Raynham
- Assignee: DePuy Synthes Products, LLC
- Current Assignee: DePuy Synthes Products, LLC
- Current Assignee Address: US MA Raynham
- Agency: Baker & Hostetler LLP
- Main IPC: A61F2/44
- IPC: A61F2/44
Abstract:
An intervertebral implant having an upper and a lower closing plate designed to engage the vertebral end plates. The implant has a deformable body between the closing plates. Between the deformable body and closing plates are cover plates. A plurality of fiber windings run between the cover plates to hold together the cover plates and the deformable body.
Public/Granted literature
- US20130138215A1 Intervertebral Implant Public/Granted day:2013-05-30
Information query
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