Invention Grant
- Patent Title: Capacitor
- Patent Title (中): 电容器
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Application No.: US13287908Application Date: 2011-11-02
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Publication No.: US08690615B2Publication Date: 2014-04-08
- Inventor: Mary Elizabeth Sullivan-Malervy , Jessica Henderson Brown-Hemond , Robert Daniel Hilty
- Applicant: Mary Elizabeth Sullivan-Malervy , Jessica Henderson Brown-Hemond , Robert Daniel Hilty
- Applicant Address: US PA Berwyn
- Assignee: Tyco Electronics Corporation
- Current Assignee: Tyco Electronics Corporation
- Current Assignee Address: US PA Berwyn
- Main IPC: H01R9/24
- IPC: H01R9/24

Abstract:
An electrical contact includes a body having a mating segment. At least a portion of the mating segment defines a first conductive element having a three-dimensional (3D) surface. A dielectric layer is formed directly on the 3D surface of the first conductive element in engagement with the 3D surface. A second conductive element is formed on the dielectric layer such that the dielectric layer extends between the first and second conductive elements. The first and second conductive elements and the dielectric layer form a capacitor.
Public/Granted literature
- US20130109234A1 CAPACITOR Public/Granted day:2013-05-02
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