Invention Grant
- Patent Title: Receptacle assembly
- Patent Title (中): 插座组件
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Application No.: US13276769Application Date: 2011-10-19
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Publication No.: US08690604B2Publication Date: 2014-04-08
- Inventor: Wayne Samuel Davis
- Applicant: Wayne Samuel Davis
- Applicant Address: US PA Berwyn
- Assignee: Tyco Electronics Corporation
- Current Assignee: Tyco Electronics Corporation
- Current Assignee Address: US PA Berwyn
- Main IPC: H01R13/648
- IPC: H01R13/648 ; H01R12/16

Abstract:
A receptacle assembly includes a front housing having a mating end and a loading end. A contact module is coupled to the loading end and includes a frame assembly having a plurality of contacts and a dielectric frame supporting the contacts. The dielectric frame has first and second sides and channels between the contacts that extend at least partially through the dielectric frame between the first and second sides. The contacts extend from the dielectric frame for electrical termination. Ground conductors are received in corresponding channels and provide electrical shielding between corresponding contacts. A ground shield is coupled to the first side. The ground shield has side shields that extend along sides of the contacts to provide electrical shielding along sides of the contacts. The ground shield has shield tabs that engage corresponding ground conductors to electrically connect the ground shield to the ground conductors.
Public/Granted literature
- US20130102192A1 RECEPTACLE ASSEMBLY Public/Granted day:2013-04-25
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