Invention Grant
US08690584B2 Contact probe device having a substrate fitted into slits of cylindrical electrodes
失效
接触探针装置,其具有嵌入圆柱形电极的狭缝中的基板
- Patent Title: Contact probe device having a substrate fitted into slits of cylindrical electrodes
- Patent Title (中): 接触探针装置,其具有嵌入圆柱形电极的狭缝中的基板
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Application No.: US12921650Application Date: 2008-05-30
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Publication No.: US08690584B2Publication Date: 2014-04-08
- Inventor: Mototsugu Shiga
- Applicant: Mototsugu Shiga
- Applicant Address: JP Kawasaki-shi
- Assignee: Elmec Corporation
- Current Assignee: Elmec Corporation
- Current Assignee Address: JP Kawasaki-shi
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- International Application: PCT/JP2008/060018 WO 20080530
- International Announcement: WO2009/144812 WO 20091203
- Main IPC: H01R12/00
- IPC: H01R12/00

Abstract:
To obtain a satisfactory contact state in an ultra high frequency range with a low loss, in a contact probe device with an electronic component connected to a mounting substrate. Insulating substrate 1 has cuts 3 with narrow width formed from an outer peripheral end. Cylindrical electrodes 9 are made of a conductive material and have slits 9a extending in its axial direction. A plurality of cylindrical electrodes 9 are supported by the insulating substrate 1 in such a manner as being inserted into each cuts 3 so that the insulating substrate 1 is fitted into each slit 9a.
Public/Granted literature
- US20110006795A1 CONTACT PROBE DEVICE Public/Granted day:2011-01-13
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