Invention Grant
US08690584B2 Contact probe device having a substrate fitted into slits of cylindrical electrodes 失效
接触探针装置,其具有嵌入圆柱形电极的狭缝中的基板

  • Patent Title: Contact probe device having a substrate fitted into slits of cylindrical electrodes
  • Patent Title (中): 接触探针装置,其具有嵌入圆柱形电极的狭缝中的基板
  • Application No.: US12921650
    Application Date: 2008-05-30
  • Publication No.: US08690584B2
    Publication Date: 2014-04-08
  • Inventor: Mototsugu Shiga
  • Applicant: Mototsugu Shiga
  • Applicant Address: JP Kawasaki-shi
  • Assignee: Elmec Corporation
  • Current Assignee: Elmec Corporation
  • Current Assignee Address: JP Kawasaki-shi
  • Agency: Westerman, Hattori, Daniels & Adrian, LLP
  • International Application: PCT/JP2008/060018 WO 20080530
  • International Announcement: WO2009/144812 WO 20091203
  • Main IPC: H01R12/00
  • IPC: H01R12/00
Contact probe device having a substrate fitted into slits of cylindrical electrodes
Abstract:
To obtain a satisfactory contact state in an ultra high frequency range with a low loss, in a contact probe device with an electronic component connected to a mounting substrate. Insulating substrate 1 has cuts 3 with narrow width formed from an outer peripheral end. Cylindrical electrodes 9 are made of a conductive material and have slits 9a extending in its axial direction. A plurality of cylindrical electrodes 9 are supported by the insulating substrate 1 in such a manner as being inserted into each cuts 3 so that the insulating substrate 1 is fitted into each slit 9a.
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