A sensor device where a jig is engaged to an engaging part formed in the housing, and the housing is rotated by the jig and screwed into the member to be mounted. A position in the rotating direction of the housing is configured to have a substantially constant position at the time the screw-fixing of the housing and the member to be mounted is completed. A shape of the engaging part when seen along a direction of a rotational axis X of the housing is formed into a non-regular polygon, and the engaging part and a mold IC are shifted and disposed to a side that has a margin in a space in the housing or around the mold IC so that the space around the sensor device is used effectively.