Invention Grant
- Patent Title: Bonding assembly
- Patent Title (中): 粘接组件
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Application No.: US13423663Application Date: 2012-03-19
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Publication No.: US08689516B2Publication Date: 2014-04-08
- Inventor: Henry E. Richardson , Jeffery Thomas Shantz , Alex Mangiapane
- Applicant: Henry E. Richardson , Jeffery Thomas Shantz , Alex Mangiapane
- Applicant Address: US MI Romeo
- Assignee: Zephyros, Inc.
- Current Assignee: Zephyros, Inc.
- Current Assignee Address: US MI Romeo
- Agency: The Dobrusin Law Firm, PC
- Main IPC: E04H12/00
- IPC: E04H12/00 ; B29C65/00
Abstract:
A device and method for the protection of a first member and second member from corrosion by utilizing a connector that bonds the members without allowing direct contact of the members.
Public/Granted literature
- US20120235401A1 BONDING ASSEMBLY Public/Granted day:2012-09-20
Information query
