Invention Grant
- Patent Title: Redundancy for on-chip interconnect
- Patent Title (中): 片上互连冗余
-
Application No.: US13612629Application Date: 2012-09-12
-
Publication No.: US08689159B1Publication Date: 2014-04-01
- Inventor: Robert Palmer , John W. Poulton , Thomas Hastings Greer, III , William James Dally
- Applicant: Robert Palmer , John W. Poulton , Thomas Hastings Greer, III , William James Dally
- Applicant Address: US CA Santa Clara
- Assignee: NVIDIA Corporation
- Current Assignee: NVIDIA Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Zilka-Kotab, PC
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
One embodiment sets forth a technique for on-chip satisfying timing requirements of on-chip source-synchronous, CMOS-repeater-based interconnect. Each channel of the on-chip interconnect may include one or more redundant wires. Calibration logic is configured to apply transition patterns to wires comprising each channel and calibration patterns that are generated in response to the transition patterns are captured. Based on the calibration patterns, wires that best satisfy the timing requirements of the on-chip interconnect are selected for use to transmit data. The calibration logic also trims the delays of the clock and selected data wires based on captured calibration patterns to improve the timing margin of the on-chip interconnect. Improving the timing margin of the on-chip interconnect improves chip yields.
Public/Granted literature
- US20140075403A1 REDUNDANCY FOR ON-CHIP INTERCONNECT Public/Granted day:2014-03-13
Information query