Invention Grant
- Patent Title: Method of fabricating semiconductor device
- Patent Title (中): 制造半导体器件的方法
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Application No.: US13406655Application Date: 2012-02-28
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Publication No.: US08689150B2Publication Date: 2014-04-01
- Inventor: Jee-eun Jung , Kyoung-yun Baek , Seong-woon Choi
- Applicant: Jee-eun Jung , Kyoung-yun Baek , Seong-woon Choi
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Lee & Morse, P.C.
- Priority: KR10-2011-0018015 20110228
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
A method of fabricating a semiconductor device includes preparing a layout of the semiconductor device, obtaining contrast of an exposure image of the layout through a simulation under a condition of using a crosspole illumination system, separating the layout into a plurality of sub-layouts based on the contrast of the exposure image, forming a photomask having a mask pattern corresponding to the plurality of sub-layouts, and performing an exposure process using the photomask under an exposure condition of using a dipole illumination system.
Public/Granted literature
- US20120220058A1 METHOD OF FABRICATING SEMICONDUCTOR DEVICE Public/Granted day:2012-08-30
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