Invention Grant
US08688223B2 Implantable medical device impedance measurement module for communication with one or more lead-borne devices 有权
可植入医疗器械阻抗测量模块,用于与一个或多个引线传导器件通信

  • Patent Title: Implantable medical device impedance measurement module for communication with one or more lead-borne devices
  • Patent Title (中): 可植入医疗器械阻抗测量模块,用于与一个或多个引线传导器件通信
  • Application No.: US12912317
    Application Date: 2010-10-26
  • Publication No.: US08688223B2
    Publication Date: 2014-04-01
  • Inventor: John D. WahlstrandJames J. St. Martin
  • Applicant: John D. WahlstrandJames J. St. Martin
  • Main IPC: A61N1/08
  • IPC: A61N1/08
Implantable medical device impedance measurement module for communication with one or more lead-borne devices
Abstract:
Example techniques for communicating between two medical devices are described. One medical device may be an implantable medical device. Another medical device may be a lead-borne implantable medical device. The lead-borne implantable medical device may be referred to as a satellite. The implantable medical device may measure impedance of a path including at least two electrodes, at least one of which is on the lead, using an impedance measurement module. In some example implementations of this disclosure, the implantable medical device may also use the impedance measurement module to communicate with the satellite on the lead.
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