Invention Grant
US08688177B2 Double-folded flexible printed circuit board for slider-type mobile devices
失效
用于滑盖式移动设备的双折式柔性印刷电路板
- Patent Title: Double-folded flexible printed circuit board for slider-type mobile devices
- Patent Title (中): 用于滑盖式移动设备的双折式柔性印刷电路板
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Application No.: US13391663Application Date: 2010-07-23
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Publication No.: US08688177B2Publication Date: 2014-04-01
- Inventor: Yawei Ma , Ichiro Yamada , Chandrashekar Subba
- Applicant: Yawei Ma , Ichiro Yamada , Chandrashekar Subba
- Applicant Address: JP Tokyo SE Lund
- Assignee: Sony Corporation,Sony Mobile Communications AB
- Current Assignee: Sony Corporation,Sony Mobile Communications AB
- Current Assignee Address: JP Tokyo SE Lund
- Agency: Snyder, Clark, Lesch & Chung, LLP
- International Application: PCT/US2010/042984 WO 20100723
- International Announcement: WO2012/011916 WO 20120126
- Main IPC: H04M1/00
- IPC: H04M1/00

Abstract:
A sliding mechanism comprising a double-folded flexible printed circuit board (FPC); a stiffener coupled to the double-folded FPC; first pins; second pins; and an opening defined by a first cover, wherein when the double-folded FPC and the stiffener move, within the opening, in synchronization along a first range of motion to an open position of the slider mechanism, the stiffener makes contact with the first pins at the open position, and when the double-folded FPC and the stiffener move, within the opening, in synchronization along a second range of motion to a closed position of the slider mechanism, the stiffener makes contact with the second pins at the closed position.
Public/Granted literature
- US20120157171A1 DOUBLE-FOLDED FLEXIBLE PRINTED CIRCUIT BOARD FOR SLIDER DEVICES Public/Granted day:2012-06-21
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