Invention Grant
- Patent Title: Method for manufacturing an electronic device including a light absorption layer
- Patent Title (中): 包括光吸收层的电子器件的制造方法
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Application No.: US13708593Application Date: 2012-12-07
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Publication No.: US08687469B1Publication Date: 2014-04-01
- Inventor: Seiichi Takayama , Yasuhiro Ito , Nobuyuki Mori , Koji Shimazawa , Kazuaki Takanuki , Youichi Ando
- Applicant: TDK Corporation , SAE Magnetics (H.K.) Ltd.
- Applicant Address: JP Tokyo CN Hong Kong
- Assignee: TDK Corporation,SAE Magnetics (H.K.) Ltd.
- Current Assignee: TDK Corporation,SAE Magnetics (H.K.) Ltd.
- Current Assignee Address: JP Tokyo CN Hong Kong
- Agency: Oliff PLC
- Main IPC: G11B11/00
- IPC: G11B11/00
Abstract:
A method of manufacturing an electronic device includes a first bonding step of bonding an electronic component and a first member together via a first bonding layer and a second bonding step of bonding the first member and a second member together via a second bonding layer after the first bonding step. The second bonding layer includes a bonding material layer made of a bonding material. In the second bonding step, with the bonding material interposed between the first and second members before being bonded together, the bonding material is heated and melted using light traveling through the first member. The first member is made of Si. The light has a wavelength in the range of 1100 to 15000 nm.
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