Invention Grant
- Patent Title: Semiconductor device and manufacturing method thereof
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US13200649Application Date: 2011-09-28
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Publication No.: US08687444B2Publication Date: 2014-04-01
- Inventor: Akira Ide , Hiroki Ichikawa
- Applicant: Akira Ide , Hiroki Ichikawa
- Applicant Address: JP Tokyo
- Assignee: Elpida Memory, Inc.
- Current Assignee: Elpida Memory, Inc.
- Current Assignee Address: JP Tokyo
- Agency: McGinn IP Law Group, PLLC
- Priority: JP2010-218699 20100929; JP2011-188570 20110831
- Main IPC: G11C7/00
- IPC: G11C7/00

Abstract:
A plurality of memory cells are tested in order. Each time a defective memory cell is detected by the test, error pattern information is updated based on a relative arrangement relationship between a plurality of defective memory cells, and error address information is updated based on the addresses of at least part of the plurality of defective memory cells. According to the present invention, it is possible to significantly reduce the storage capacity of the analysis memory. This allows the implementation of the analysis memory itself in the semiconductor device, in which case external testers need not include the analysis memory.
Public/Granted literature
- US20120075944A1 Semiconductor device and manufacturing method thereof Public/Granted day:2012-03-29
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