Invention Grant
US08687442B1 Delay matching across semiconductor devices using input/output pads
有权
使用输入/输出焊盘延迟半导体器件的匹配
- Patent Title: Delay matching across semiconductor devices using input/output pads
- Patent Title (中): 使用输入/输出焊盘延迟半导体器件的匹配
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Application No.: US13291629Application Date: 2011-11-08
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Publication No.: US08687442B1Publication Date: 2014-04-01
- Inventor: Priyanka Thakore , Meng-Kun Lee
- Applicant: Priyanka Thakore , Meng-Kun Lee
- Applicant Address: US CA San Jose
- Assignee: SK hynix memory solutions inc.
- Current Assignee: SK hynix memory solutions inc.
- Current Assignee Address: US CA San Jose
- Agency: Van Pelt, Yi & James LLP
- Main IPC: G11C7/00
- IPC: G11C7/00

Abstract:
A data signal is sampled by generating a read enable signal at a first semiconductor device which is intended for a second semiconductor device. A read enable signal with at least some I/O pad delay included is obtained, including by passing the read enable signal intended for the second semiconductor device at least partially through an input/output (I/O) pad on the first semiconductor device. At the first semiconductor device, a data signal from the second semiconductor is sampled using the read enable signal with at least some I/O pad delay included.
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