Invention Grant
US08687408B2 Highly integrated programmable non-volatile memory and manufacturing method thereof
有权
高度集成的可编程非易失性存储器及其制造方法
- Patent Title: Highly integrated programmable non-volatile memory and manufacturing method thereof
- Patent Title (中): 高度集成的可编程非易失性存储器及其制造方法
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Application No.: US13614242Application Date: 2012-09-13
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Publication No.: US08687408B2Publication Date: 2014-04-01
- Inventor: Euipil Kwon
- Applicant: Euipil Kwon
- Applicant Address: US CA San Jose
- Assignee: Rangduru, Inc.
- Current Assignee: Rangduru, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Staas & Halsey LLP
- Priority: KR10-2011-0096072 20110923
- Main IPC: G11C11/00
- IPC: G11C11/00 ; G11C5/02 ; G11C13/00

Abstract:
A highly integrated programmable non-volatile memory and a manufacturing method thereof are provided. More particularly, a memory device including an antifuse and a diode, or a variable resistor and a diode, an operation method thereof, and a manufacturing method of a plurality of memory cells capable of increasing the integration density by utilizing a vertical space are provided. The highly integrated programmable non-volatile memory includes first stepped cells and second stepped cells formed to have different heights. The first stepped cells are formed on a horizontal plane with a high height, and the second stepped cells are formed on a horizontal plane with a low height.
Public/Granted literature
- US20130077381A1 HIGHLY INTEGRATED PROGRAMMABLE NON-VOLATILE MEMORY AND MANUFACTURING METHOD THEREOF Public/Granted day:2013-03-28
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