Invention Grant
US08687408B2 Highly integrated programmable non-volatile memory and manufacturing method thereof 有权
高度集成的可编程非易失性存储器及其制造方法

  • Patent Title: Highly integrated programmable non-volatile memory and manufacturing method thereof
  • Patent Title (中): 高度集成的可编程非易失性存储器及其制造方法
  • Application No.: US13614242
    Application Date: 2012-09-13
  • Publication No.: US08687408B2
    Publication Date: 2014-04-01
  • Inventor: Euipil Kwon
  • Applicant: Euipil Kwon
  • Applicant Address: US CA San Jose
  • Assignee: Rangduru, Inc.
  • Current Assignee: Rangduru, Inc.
  • Current Assignee Address: US CA San Jose
  • Agency: Staas & Halsey LLP
  • Priority: KR10-2011-0096072 20110923
  • Main IPC: G11C11/00
  • IPC: G11C11/00 G11C5/02 G11C13/00
Highly integrated programmable non-volatile memory and manufacturing method thereof
Abstract:
A highly integrated programmable non-volatile memory and a manufacturing method thereof are provided. More particularly, a memory device including an antifuse and a diode, or a variable resistor and a diode, an operation method thereof, and a manufacturing method of a plurality of memory cells capable of increasing the integration density by utilizing a vertical space are provided. The highly integrated programmable non-volatile memory includes first stepped cells and second stepped cells formed to have different heights. The first stepped cells are formed on a horizontal plane with a high height, and the second stepped cells are formed on a horizontal plane with a low height.
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