Invention Grant
- Patent Title: Wiring structure for electronic apparatus, and electronic apparatus
- Patent Title (中): 电子设备和电子设备的接线结构
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Application No.: US12857861Application Date: 2010-08-17
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Publication No.: US08687381B2Publication Date: 2014-04-01
- Inventor: Naoyuki Iwata , Atsushi Aketo
- Applicant: Naoyuki Iwata , Atsushi Aketo
- Applicant Address: JP Tokyo
- Assignee: Fuji Xerox Co., Ltd.
- Current Assignee: Fuji Xerox Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2010-014411 20100126
- Main IPC: H05K5/02
- IPC: H05K5/02
Abstract:
A wiring structure for an electronic apparatus has a structure in which a first wiring path where a first harness that is used for transmitting a primary power is wired and a second wiring path where a second harness that is used for transmitting a secondary power is wired are formed, and a structure related to the first wiring path is formed so that, in a case where the first harness is wired, the first harness is integrated with the structure related to the first wiring path.
Public/Granted literature
- US20110182049A1 WIRING STRUCTURE FOR ELECTRONIC APPARATUS, AND ELECTRONIC APPARATUS Public/Granted day:2011-07-28
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