Invention Grant
- Patent Title: Signal conversion device with dual chip
- Patent Title (中): 信号转换装置采用双芯片
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Application No.: US13779166Application Date: 2013-02-27
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Publication No.: US08687379B2Publication Date: 2014-04-01
- Inventor: Feng-Chi Hsiao , Kun-Shan Yang , Tung-Fu Lin , Chin-Fen Cheng , Chih-Wei Lee
- Applicant: Phytrex Technology Corporation
- Applicant Address: TW Taipei
- Assignee: Phytrex Technology Corporation
- Current Assignee: Phytrex Technology Corporation
- Current Assignee Address: TW Taipei
- Agency: Morris Manning & Martin LLP
- Agent Tim Tingkang Xia, Esq.
- Priority: TW98209358U 20090527
- Main IPC: H05K1/11
- IPC: H05K1/11

Abstract:
The present invention provides a dual chip signal conversion device, comprising: a carrier, one side surface thereof being provided with at least a first contact and a second contact while the other side surface thereof being provided with at least a third contact and a fourth contact; a first chip disposed at one side surface of the carrier and electrically connected to the second and fourth contacts; a second chip disposed at one side surface of the carrier and electrically connected to the first chip; and an antenna disposed within the carrier and electrically connected to the second chip.
Public/Granted literature
- US20130170168A1 SIGNAL CONVERSION DEVICE WITH DUAL CHIP Public/Granted day:2013-07-04
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