Invention Grant
- Patent Title: Storage device, electronic device, and circuit board assembly
- Patent Title (中): 存储设备,电子设备和电路板组件
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Application No.: US13308432Application Date: 2011-11-30
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Publication No.: US08687377B2Publication Date: 2014-04-01
- Inventor: Masaru Harashima , Norihiro Ishii
- Applicant: Masaru Harashima , Norihiro Ishii
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Priority: JP2011-080674 20110331
- Main IPC: H05K5/00
- IPC: H05K5/00

Abstract:
According to one embodiment, a storage device includes a housing, a circuit board, and a module. The circuit board is located in the housing, and includes a first surface and a second surface located opposite the first surface. The module is provided on at least one of the first surface and the second surface of the circuit board. The circuit board is provided with a first notch and a connection portion to be connected to the housing at the periphery. The first notch is provided with a second notch extending toward an area between the connection portion and a module fixation area where the module is fixed on the circuit board.
Public/Granted literature
- US20120250279A1 STORAGE DEVICE, ELECTRONIC DEVICE, AND CIRCUIT BOARD ASSEMBLY Public/Granted day:2012-10-04
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