An assembled structure includes an integrated circuit chipset and a heat-dissipating module. The heat-dissipating module includes a heat sink, a locking member and at least one elastic element. The heat sink includes a base and a plurality of fins. The locking member includes a rectangular frame with at least one sustaining part. Two first lateral plates are downwardly extended from a first side and a second side of the rectangular frame, respectively. The first side and the second side are opposed to each other. In addition, at least one hook is formed on an inner surface and a lower edge of each first lateral plate. The elastic element has a first part sustained against the base of the heat sink and a second part sustained against the sustaining part of the rectangular frame. The hooks are engaged with a bottom surface of the substrate of the integrated circuit chipset.