Invention Grant
- Patent Title: Die arrangement and method of forming a die arrangement
- Patent Title (中): 模具布置和形成模具布置的方法
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Application No.: US12967281Application Date: 2010-12-14
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Publication No.: US08686569B2Publication Date: 2014-04-01
- Inventor: Frank Daeche , Joachim Mahler , Anton Prueckl , Stefan Landau , Josef Hoeglauer
- Applicant: Frank Daeche , Joachim Mahler , Anton Prueckl , Stefan Landau , Josef Hoeglauer
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40 ; H01L23/495 ; H01L23/02 ; H01L23/04
Abstract:
A die arrangement includes a carrier having a first side and a second side opposite the first side, the carrier including an opening leading from the first side of the carrier to the second side of the carrier; a first die disposed over the first side of the carrier and electrically contacting the carrier; a second die disposed over the second side of the carrier and electrically contacting the carrier; and an electrical contact structure leading through the opening in the carrier and electrically contacting the second die.
Public/Granted literature
- US20120146201A1 DIE ARRANGEMENT AND METHOD OF FORMING A DIE ARRANGEMENT Public/Granted day:2012-06-14
Information query
IPC分类:
