Invention Grant
- Patent Title: Substrate for a microelectronic package and method of fabricating thereof
- Patent Title (中): 微电子封装用基板及其制造方法
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Application No.: US13488828Application Date: 2012-06-05
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Publication No.: US08686551B2Publication Date: 2014-04-01
- Inventor: Belgacem Haba , Craig S. Mitchell , Apolinar Alvarez, Jr.
- Applicant: Belgacem Haba , Craig S. Mitchell , Apolinar Alvarez, Jr.
- Applicant Address: US CA San Jose
- Assignee: Tessera, Inc.
- Current Assignee: Tessera, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Lerner, David, Littenberg, Krumholz & Mentlik, LLP
- Main IPC: H01L23/02
- IPC: H01L23/02 ; H01L23/34 ; H01L23/29 ; H01L23/52
Abstract:
Substrates having molded dielectric layers and methods of fabricating such substrates are disclosed. The substrates may advantageously be used in microelectronic assemblies having high routing density.
Public/Granted literature
- US20120241960A1 SUBSTRATE FOR A MICROELECTRONIC PACKAGE AND METHOD OF FABRICATING THEREOF Public/Granted day:2012-09-27
Information query
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