Invention Grant
- Patent Title: Electrical fuse structure and method of formation
- Patent Title (中): 电熔丝结构及形成方法
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Application No.: US12771768Application Date: 2010-04-30
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Publication No.: US08686536B2Publication Date: 2014-04-01
- Inventor: Shien-Yang Wu , Wei-Chan Kung
- Applicant: Shien-Yang Wu , Wei-Chan Kung
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: H01L23/52
- IPC: H01L23/52
Abstract:
An embodiment is a fuse structure. In accordance with an embodiment, a fuse structure comprises an anode, a cathode, a fuse link interposed between the anode and the cathode, and cathode connectors coupled to the cathode. The cathode connectors are each equivalent to or larger than about two times a minimum feature size of a contact that couples to an active device.
Public/Granted literature
- US20110101493A1 Electrical Fuse Structure and Method of Formation Public/Granted day:2011-05-05
Information query
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