Invention Grant
- Patent Title: Electronic component and a method of manufacturing an electronic component
- Patent Title (中): 电子部件和电子部件的制造方法
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Application No.: US12669676Application Date: 2008-07-16
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Publication No.: US08686530B2Publication Date: 2014-04-01
- Inventor: Christoph Wilhelm Sele , Monica Johanna Beenhakkers , Gerwin Hermanus Gelinck , Nicolaas Aldegonda Jan Maria Van Aerle , Hjalmar Edzer Ayco Huitema
- Applicant: Christoph Wilhelm Sele , Monica Johanna Beenhakkers , Gerwin Hermanus Gelinck , Nicolaas Aldegonda Jan Maria Van Aerle , Hjalmar Edzer Ayco Huitema
- Applicant Address: NL Breda
- Assignee: Creator Technology B.V.
- Current Assignee: Creator Technology B.V.
- Current Assignee Address: NL Breda
- International Application: PCT/NL2008/050481 WO 20080716
- International Announcement: WO2009/011580 WO 20090122
- Main IPC: H01L29/02
- IPC: H01L29/02

Abstract:
An electronic component, notably one including, for example, a TFT, a storage capacitor, or a crossing between electrically conductive layers of a stack device is disclosed. The electronic component comprises a substrate whereon a first electrically conductive layer forming electrode is provided. A second electrode formed by a second electrically conductive layer is separated from the first electrode by at least a dielectric layer, comprising an interlayer of an electrically insulating material, preferably having high resistance against electrical breakdown and a further layer of a photo-patternable electrically insulating material.
Public/Granted literature
- US20100320448A1 Electronic Component And A Method Of Manufacturing An Electronic Component Public/Granted day:2010-12-23
Information query
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