Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US13226628Application Date: 2011-09-07
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Publication No.: US08686499B2Publication Date: 2014-04-01
- Inventor: Masaya Katayama , Masayoshi Asano
- Applicant: Masaya Katayama , Masayoshi Asano
- Applicant Address: JP Yokohama
- Assignee: Fujitsu Semiconductor Limited
- Current Assignee: Fujitsu Semiconductor Limited
- Current Assignee Address: JP Yokohama
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2010-252479 20101111
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/76 ; H01L21/02

Abstract:
A semiconductor device includes a p-type semiconductor substrate, an n-type drift region formed in the p-type semiconductor substrate, and a p-type body region formed in the n-type drift region. A circular gate electrode is formed over a pn junction between sides of the p-type body region and the n-type drift region along the pn junction. An n-type drain region and an n-type source region are formed in the n-type drift region and the p-type body region, respectively, with a part of the gate electrode between.
Public/Granted literature
- US20120119292A1 SEMICONDUCTOR DEVICE Public/Granted day:2012-05-17
Information query
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