Invention Grant
- Patent Title: Semiconductor devices and methods of manufacturing the same
- Patent Title (中): 半导体器件及其制造方法
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Application No.: US13760597Application Date: 2013-02-06
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Publication No.: US08686485B2Publication Date: 2014-04-01
- Inventor: Jong Un Kim
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-Do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-Do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2012-0028339 20120320
- Main IPC: H01L21/02
- IPC: H01L21/02

Abstract:
A semiconductor device may include active patterns of pillar-shapes disposed on a substrate and spaced apart from each other in one direction; a gate electrode extending in the one direction and overlapped with sidewalls of the active patterns; a gate insulating layer disposed between the gate electrode and the active patterns; bit lines connected to bottom surfaces of respective active patterns; and/or capacitors connected to top surfaces of the respective active patterns. Each of the active patterns may have no p-type/n-type (PN) junctions. A semiconductor device may include a substrate; active patterns on the substrate that are spaced apart from each other; a gate electrode configured to overlap sidewalls of the active patterns; and/or gate insulating layers between the gate electrode and respective active patterns. The active patterns may be doped with dopants of a same conductivity type.
Public/Granted literature
- US20130248956A1 SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THE SAME Public/Granted day:2013-09-26
Information query
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