Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US13093397Application Date: 2011-04-25
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Publication No.: US08686469B2Publication Date: 2014-04-01
- Inventor: Katsumi Nakamura
- Applicant: Katsumi Nakamura
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2010-120180 20100526; JP2011-021828 20110203
- Main IPC: H01L29/02
- IPC: H01L29/02

Abstract:
A semiconductor device includes a semiconductor substrate having a diode active region and an edge termination region adjacent to each other, a first region of a first conductivity type in the diode active region, a second region of a second conductivity type, a third region of the first conductivity type in the edge termination region, and a fourth region of the second conductivity type. The first region and the third region share a drift region of the first conductivity type. The first region and the third region share a fifth region of the first conductivity type. The drift region in the third region is greater in number of crystal defects per unit volume than the drift region in the first region in order that the drift region in the third region is shorter in carrier lifetime than the drift region in the first region.
Public/Granted literature
- US20110291223A1 SEMICONDUCTOR DEVICE Public/Granted day:2011-12-01
Information query
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