A light emission package includes at least one solid state emitter, a leadframe including at least one electrical lead and a body structure encasing a portion of the leadframe. A thermal transfer material can be isolated from the at least one electrical lead. The body structure can include a plastic body structure wherein a rim portion can be disposed along a portion of the upper surface of the body structure. The light emission package can also include the at least one solid state emitter mounted over thermal transfer material using a direct metal-to-metal bond such as by eutectic die attachment. The light emission package is operable to emit light with an output of approximately 70% or greater of an initial light output for an extrapolated time of at least approximately 150,000 hours or more.