Invention Grant
- Patent Title: Nitride semiconductor light emitting device and method of manufacturing the same
- Patent Title (中): 氮化物半导体发光器件及其制造方法
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Application No.: US13478024Application Date: 2012-05-22
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Publication No.: US08686442B2Publication Date: 2014-04-01
- Inventor: Akihisa Terano , Aki Takei
- Applicant: Akihisa Terano , Aki Takei
- Applicant Address: JP Yokohama-shi
- Assignee: Oclaro Japan, Inc.
- Current Assignee: Oclaro Japan, Inc.
- Current Assignee Address: JP Yokohama-shi
- Agency: Miles & Stockbridge P.C.
- Priority: JP2008-035868 20080218
- Main IPC: H01L27/15
- IPC: H01L27/15 ; H01L29/26

Abstract:
The present invention provides a nitride semiconductor light emitting device having an n-electrode that has an Au face excellent in ohmic contacts to an n-type nitride semiconductor and excellent in mounting properties, and a method of manufacturing the same. The nitride semiconductor light emitting device uses an n-electrode having a three-layer laminate structure that is composed of a first layer containing aluminum nitride and having a thickness not less than 1 nm or less than 5 nm, a second layer containing one or more metals selected from Ti, Zr, Hf, Mo, and Pt, and a third layer made of Au, from the near side of the n-type nitride semiconductor in order of mention. The n-electrode thus formed is then annealed to obtain ohmic contacts to the n-type nitride semiconductor.
Public/Granted literature
- US20120228664A1 NITRIDE SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2012-09-13
Information query
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