Invention Grant
- Patent Title: Method for manufacturing semiconductor device
- Patent Title (中): 制造半导体器件的方法
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Application No.: US13584840Application Date: 2012-08-14
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Publication No.: US08686425B2Publication Date: 2014-04-01
- Inventor: Shunpei Yamazaki , Takuya Hirohashi , Masahiro Takahashi , Takashi Shimazu
- Applicant: Shunpei Yamazaki , Takuya Hirohashi , Masahiro Takahashi , Takashi Shimazu
- Applicant Address: JP Atsugi-shi, Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Atsugi-shi, Kanagawa-ken
- Agency: Robinson Intellectual Property Law Office, P.C.
- Agent Eric J. Robinson
- Priority: JP2009-296825 20091228
- Main IPC: H01L31/112
- IPC: H01L31/112 ; H01L21/00

Abstract:
A larger substrate can be used, and a transistor having a desirably high field-effect mobility can be manufactured through formation of an oxide semiconductor layer having a high degree of crystallinity, whereby a large-sized display device, a high-performance semiconductor device, or the like can be put into practical use. A first multi-component oxide semiconductor layer is formed over a substrate and a single-component oxide semiconductor layer is formed thereover; then, crystal growth is carried out from a surface to an inside by performing heat treatment at 500° C. to 1000° C. inclusive, preferably 550° C. to 750° C. inclusive so that a first multi-component oxide semiconductor layer including single crystal regions and a single-component oxide semiconductor layer including single crystal regions are formed; and a second multi-component oxide semiconductor layer including single crystal regions is stacked over the single-component oxide semiconductor layer including single crystal regions.
Public/Granted literature
- US20120305913A1 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE Public/Granted day:2012-12-06
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