Invention Grant
- Patent Title: Solvent resistance of epoxy resins toughened with polyethersulfone
- Patent Title (中): 用聚醚砜增韧的环氧树脂的耐溶剂性
-
Application No.: US12902312Application Date: 2010-10-12
-
Publication No.: US08686069B2Publication Date: 2014-04-01
- Inventor: Yen-Seine Wang
- Applicant: Yen-Seine Wang
- Applicant Address: US CA Dublin
- Assignee: Hexcel Corporation
- Current Assignee: Hexcel Corporation
- Current Assignee Address: US CA Dublin
- Agent W. Mark Bielawski; David J. Oldenkamp
- Main IPC: C08L63/00
- IPC: C08L63/00 ; C08K7/04 ; C08L81/06 ; C08G59/32
Abstract:
The solvent resistance of epoxy resins toughened with polyethersulfone is improved by using low molecular weight polyethersulfone. The resulting thermoplastic toughened epoxy resins are useful for making prepreg for aerospace applications.
Public/Granted literature
- US20120088864A1 SOLVENT RESISTANCE OF EPOXY RESINS TOUGHENED WITH POLYETHERSULFONE Public/Granted day:2012-04-12
Information query
