Invention Grant
- Patent Title: Fabrication method of package structure with simplified encapsulation structure and simplified wiring
- Patent Title (中): 具有简化封装结构和简化布线的封装结构制造方法
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Application No.: US12591071Application Date: 2009-11-06
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Publication No.: US08685834B2Publication Date: 2014-04-01
- Inventor: Pei-Haw Tsao , Chender Huang , Chuen-Jye Lin
- Applicant: Pei-Haw Tsao , Chender Huang , Chuen-Jye Lin
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Main IPC: H01L21/30
- IPC: H01L21/30 ; H01L21/46
Abstract:
A package structure and fabrication method thereof. The structure includes a substrate having a terminal, a chip overlying the substrate, the chip having an active surface, having a center region and periphery region, the periphery region having an electrode thereon, a patterned cover plate overlying the chip and exposing the electrode, a conductive material electrically connecting the electrode and terminal, and an encapsulant covering the terminal, conductive material, and electrode, but exposing the cover plate overlying the center region of the chip.
Public/Granted literature
- US20100068846A1 Package structure and fabrication method thereof Public/Granted day:2010-03-18
Information query
IPC分类:
