Invention Grant
US08685794B2 Lead frame land grid array with routing connector trace under unit
有权
引线框架地面网格阵列，具有路由连接器跟踪单元
- Patent Title: Lead frame land grid array with routing connector trace under unit
- Patent Title (中): 引线框架地面网格阵列，具有路由连接器跟踪单元
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Application No.: US13904975Application Date: 2013-05-29
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Publication No.: US08685794B2Publication Date: 2014-04-01
- Inventor: Somchai Nondhasitthichai , Saravuth Sirinorakul , Kasemsan Kongthaworn , Vorajit Suwannaset
- Applicant: UTAC Thai Limited
- Applicant Address: TH Bangkok
- Assignee: UTAC Thai Limited
- Current Assignee: UTAC Thai Limited
- Current Assignee Address: TH Bangkok
- Agency: Haverstock & Owens LLP
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A package includes a first plated area, a second plated area, a die attached to the first plated area, and a bond coupling the die to the second plated area. The package further includes a molding encapsulating the die, the bond, and the top surfaces of the first and second plated areas, such that the bottom surfaces of the first and second plated areas are exposed exterior to the package. Additional embodiments include a method of making the package.
Public/Granted literature
- US20130337609A1 LEAD FRAME LAND GRID ARRAY WITH ROUTING CONNECTOR TRACE UNDER UNIT Public/Granted day:2013-12-19
Information query
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