Invention Grant
- Patent Title: Ribbon bonding in an electronic package
- Patent Title (中): 带状结合在一个电子包装
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Application No.: US12776199Application Date: 2010-05-07
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Publication No.: US08685789B2Publication Date: 2014-04-01
- Inventor: Christoph B. Luechinger
- Applicant: Christoph B. Luechinger
- Applicant Address: US CA Irvine
- Assignee: Orthodyne Electronics Corporation
- Current Assignee: Orthodyne Electronics Corporation
- Current Assignee Address: US CA Irvine
- Agency: Haynes and Boone, LLP
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A flexible conductive ribbon is ultrasonically bonded to the surface of a die and terminals from a lead frame of a package. Multiple ribbons and/or multiple bonded areas provide various benefits, such as high current capability, reduced spreading resistance, reliable bonds due to large contact areas, lower cost and higher throughput due to less areas to bond and test.
Public/Granted literature
- US20100214754A1 RIBBON BONDING IN AN ELECTRONIC PACKAGE Public/Granted day:2010-08-26
Information query
IPC分类:
