Invention Grant
- Patent Title: Method to make low resistance contact
- Patent Title (中): 低阻抗接触方法
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Application No.: US11761897Application Date: 2007-06-12
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Publication No.: US08685764B2Publication Date: 2014-04-01
- Inventor: Chen-Fu Chu , Wen-Huang Liu , Jiunn-Yi Chu , Chao-Chen Cheng , Hao-Chun Cheng , Feng-Hsu Fan , Trung Tri Doan
- Applicant: Chen-Fu Chu , Wen-Huang Liu , Jiunn-Yi Chu , Chao-Chen Cheng , Hao-Chun Cheng , Feng-Hsu Fan , Trung Tri Doan
- Applicant Address: TW Miao-Li County
- Assignee: SemiLEDs Optoelectronics Co., Ltd.
- Current Assignee: SemiLEDs Optoelectronics Co., Ltd.
- Current Assignee Address: TW Miao-Li County
- Agency: Patterson & Sheridan, L.L.P.
- Main IPC: H01L33/00
- IPC: H01L33/00

Abstract:
Techniques for fabricating contacts on inverted configuration surfaces of GaN layers of semiconductor devices are provided. An n-doped GaN layer may be formed with a surface exposed by removing a substrate on which the n-doped GaN layer was formed. The crystal structure of such a surface may have a significantly different configuration than the surface of an as-deposited p-doped GaN layer.
Public/Granted literature
- US20080035950A1 METHOD TO MAKE LOW RESISTANCE CONTACT Public/Granted day:2008-02-14
Information query
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