Invention Grant
- Patent Title: Surface coating for electronic systems
- Patent Title (中): 电子系统表面涂层
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Application No.: US13447456Application Date: 2012-04-16
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Publication No.: US08685529B1Publication Date: 2014-04-01
- Inventor: Junghyun Cho , Scott Oliver , Wayne Jones , Bahgat Sammakia
- Applicant: Junghyun Cho , Scott Oliver , Wayne Jones , Bahgat Sammakia
- Applicant Address: US NY Binghamton
- Assignee: The Research Foundation for The State University of New York
- Current Assignee: The Research Foundation for The State University of New York
- Current Assignee Address: US NY Binghamton
- Agency: Ostrolenk Faber LLP
- Agent Steven M. Hoffberg
- Main IPC: B32B27/00
- IPC: B32B27/00 ; B41M5/52 ; B32B27/08 ; H05K1/03 ; H05K3/46 ; C04B41/87 ; C04B41/89

Abstract:
A method for coating for a substrate, comprising applying an underlayer of a self assembling monolayer well ordered array of long chain molecules on the substrate; and applying a top layer, over the underlayer, wherein the self-assembling monolayer well ordered array serves as a molecular template organizing formation of said top layer, comprising at least one of a thermally-resistant polymer layer over said self assembling monolayer selected from the group consisting of epoxies, and phosphorus-based polyimides; and a metal oxide, metal nitride, or a ceramic. The self assembling monolayer may be selectively applied to a portion of the substrate, leaving an uncoated region, and the top layer formed only over the areas of the substrate coated with the self-assembling monolayer, resulting in at least one region of the substrate which is not coated with the top layer.
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