Invention Grant
- Patent Title: Molding apparatus and molding method
- Patent Title (中): 成型设备及成型方法
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Application No.: US12238617Application Date: 2008-09-26
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Publication No.: US08685306B2Publication Date: 2014-04-01
- Inventor: Junichi Seki
- Applicant: Junichi Seki
- Applicant Address: JP Tokyo
- Assignee: Canon Kabushiki Kaisha
- Current Assignee: Canon Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Fitzpatrick, Cella, Harper & Scinto
- Priority: JP2004-044726 20040220
- Main IPC: B29C59/00
- IPC: B29C59/00
Abstract:
A molding apparatus for patterning a workpiece includes a first support member for supporting the mold, a second support member arranged opposite to the first support member, and a pressing mechanism for pressing the mold and the work together using the support members to pattern the workpiece. In this structure, either the surface of the first support member for supporting the mold or the surface of the second support member for supporting the workpiece is smaller in area than both surfaces of the mold and the workpiece.
Public/Granted literature
- US20090032998A1 MOLDING APPARATUS AND MOLDING METHOD Public/Granted day:2009-02-05
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