Invention Grant
- Patent Title: Inflation sensor mount and method of assembly
- Patent Title (中): 充气传感器座和组装方法
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Application No.: US13523611Application Date: 2012-06-14
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Publication No.: US08684964B2Publication Date: 2014-04-01
- Inventor: Brian Stevens , Blaine Johnson , Randy Boyd , Steve Taylor
- Applicant: Brian Stevens , Blaine Johnson , Randy Boyd , Steve Taylor
- Applicant Address: US UT South Jordan
- Assignee: Merit Medical Systems, Inc.
- Current Assignee: Merit Medical Systems, Inc.
- Current Assignee Address: US UT South Jordan
- Agency: Stoel Rives LLP
- Main IPC: A61M29/00
- IPC: A61M29/00
Abstract:
An inflation device comprising a housing configured to receive a sensor assembly is disclosed. In some embodiments, the sensor assembly may be coupled to the housing through use of a snap fit-type connection. Further, the working fluid of the inflation device may be in direct communication with the pressure sensor, without the use of secondary fluids such as gels.
Public/Granted literature
- US20130338581A1 INFLATION SENSOR MOUNT AND METHOD OF ASSEMBLY Public/Granted day:2013-12-19
Information query
