Invention Grant
US08684793B2 Oxidizing particles based slurry for nobel metal including ruthenium chemical mechanical planarization
有权
氧化颗粒基浆料用于诺贝尔金属，包括钌化学机械平面化
- Patent Title: Oxidizing particles based slurry for nobel metal including ruthenium chemical mechanical planarization
- Patent Title (中): 氧化颗粒基浆料用于诺贝尔金属，包括钌化学机械平面化
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Application No.: US13266520Application Date: 2010-05-06
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Publication No.: US08684793B2Publication Date: 2014-04-01
- Inventor: Yuzhuo Li , Karpagavalli Ramji
- Applicant: Yuzhuo Li , Karpagavalli Ramji
- Applicant Address: DE Ludwigshafen
- Assignee: BASF SE
- Current Assignee: BASF SE
- Current Assignee Address: DE Ludwigshafen
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- International Application: PCT/EP2010/056139 WO 20100506
- International Announcement: WO2010/128094 WO 20101111
- Main IPC: B24B1/00
- IPC: B24B1/00
Abstract:
A method for chemical mechanical planarization of ruthenium is provided. A semiconductor substrate comprising ruthenium is contacted with a chemical mechanical polishing system comprising an oxidizing particle, an abrasive, a polishing pad and a liquid carrier. The pH of the polishing composition is about 8 to 12. A high ruthenium removal rate for the inventive slurry was observed. The disclosed oxidizing particle advantageously improves the polishing speed of ruthenium under low polishing pressure and decreases the scratches generated on low-k material.
Public/Granted literature
- US20120045970A1 OXIDIZING PARTICLES BASED SLURRY FOR NOBEL METAL INCLUDING RUTHENIUM CHEMICAL MECHANICAL PLANARIZATION Public/Granted day:2012-02-23
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