A linear, automated apparatus and method for clean, cost-effective, simultaneous lapping and polishing of optics, semiconductors and optoelectronic materials is presented, constructed principally from corrosion resistant stainless steel or nickel, enabling utilization of high purity water based abrasive slurry. The circular stainless steel or nickel lapping plate of the apparatus supports a synthetic nylon or rayon pad, whereby material is abraded from the workpiece primarily through the reciprocal, back and forth, linear movement of the workpiece holder, diametrically across the circular lapping plate, with intermittent rotation in step increments of the workpiece holder and affixed workpiece, tracing arcs of 180 degrees, first in a clockwise and subsequently counterclockwise direction. Intermittent rotation of the circular lapping plate for the sole purpose of ensuring uniform wear on the circular nylon or rayon pad and lapping plate, eliminates the need for periodic, time consuming conditioning or reflattening of the lapping plate.